Heat Sink Fins Design

Fins are used to increase heat transfer area and provide a cooling effect.

Heat sink fins design.

Cad model of a heat sink. Figure 1 shows a typical plate fin heat sink used to cool common electrical and electronic components such as leds used in lighting applications mosfet used in digital circuits and microprocessors. H air film convective coefficient a exposed surface area of. A heat sink also commonly spelled heatsink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium often air or a liquid coolant where it is dissipated away from the device thereby allowing regulation of the device s temperature.

A heat sink transfers the thermal energy generated by an electronic assembly or component into a cooling medium. Plate fin heat sink dimensions. In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules. Heat sinks are typically made of aluminum or copper and have fins or pins that work to increase the surface area of the component to expedite the heat transfer to the surrounding fluid.

The heat sink size calculator is based on a well established equation for estimating heat sink volume during the early stages of heat sink design. A reference link has been placed below the calculator for further reading. Heat transfer design and engineering. Heat sink design key considerations in heat sink design.

There are six dimensions that would need to be determined to design an appropriate heat sink for your needs. Heat transfer by convection of a heat sink with fins calculator and equations. The heat is transferred from a higher temperature region electronic component to a lower temperature region fluid medium by conduction.